Sei High Yield Bond Alternative Credit Etf (LEND)

• Sei High Yield Bond Alternative Credit Etf (LEND) currently pays a dividend of $0.1343 per share with annual dividend yield of 6.69% and price-to-earnings ratio of -.
• Sei High Yield Bond Alternative Credit Etf (LEND) pays out a dividend twelve times per year. Monthly payment frequency should be carefully considered as it can affect investors’ investment strategy.
• Sei High Yield Bond Alternative Credit Etf (LEND) most recent ex-dividend date occurred on October 05, 2026 with dividend payment of $0.1343 per share received on October 06, 2026. Shareholders eligible for this dividend payment owned LEND stock before or on this ex-dividend date.

Table below shows the detailed dividend history of Sei High Yield Bond Alternative Credit Etf Stock (LEND). In 2026, the first Sei High Yield Bond Alternative Credit Etf’s dividend date was on July 06, 2026 with a dividend of $0.245 per share, representing a -75.02% decrease from $0.9809 per share on December 30, 2019. This decline in LEND’s dividend pay out can signal a negative financial performance of the company; however, further research should be conducted to understand the company’s change in dividend payment. We recommend investors to review dividend dates and payments carefully with the aim to gain insights on the company’s strategy.