28.97
3.75%
-1.13
After Hours:
28.95
-0.02
-0.07%
AMKOR Technology Inc. stock is currently priced at $28.97, with a 24-hour trading volume of 991.31K.
It has seen a -3.75% decreased in the last 24 hours and a -6.67% declined in the past month.
The chart indicates a potential bearish trend, as the stock is below the $30.39 pivot point. If it approaches the $28.94 support level, significant changes may occur.
AMKOR Technology Inc. Stock (AMKR) Financials Data
AMKOR Technology Inc. (AMKR) Revenue 2024
AMKR reported a revenue (TTM) of $6.50 billion for the quarter ending December 31, 2023, a -8.30% decline year-over-year.
AMKOR Technology Inc. (AMKR) Net Income 2024
AMKR net income (TTM) was $359.81 million for the quarter ending December 31, 2023, a -53.02% decrease year-over-year.
AMKOR Technology Inc. (AMKR) Cash Flow 2024
AMKR recorded a free cash flow (TTM) of $520.55 million for the quarter ending December 31, 2023, a +173.31% increase year-over-year.
AMKOR Technology Inc. (AMKR) Earnings per Share 2024
AMKR earnings per share (TTM) was $1.46 for the quarter ending December 31, 2023, a -53.05% decline year-over-year.
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About AMKOR Technology Inc.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer back-grinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip and other interconnect technologies. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; Wafer-level fan-out packages used in ICs; and silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure. Further, the company provides leadframe packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, baseband processing, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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