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Chipmos Technologies Inc ADR stock is currently priced at $28.59, with a 24-hour trading volume of 9,016. It has seen a +2.66% increased in the last 24 hours and a -6.29% declined in the past month. The chart indicates a potential bullish trend, as the stock is above the $27.90 pivot point. If it approaches the $28.75 resistance level, significant changes may occur.
Previous Close:
$27.85
Open:
$28.02
24h Volume:
9,016
Market Cap:
$1.04B
Revenue:
$677.73M
Net Income/Loss:
$62.58M
P/E Ratio:
6.2213
EPS:
4.5955
Net Cash Flow:
-
1W Performance:
+0.88%
1M Performance:
-6.29%
6M Performance:
+13.23%
1Y Performance:
+19.42%
1D Range:
Value
$28.02
$28.59
52W Range:
Value
$21.58
$32.19

Chipmos Technologies Inc ADR Stock (IMOS) Company Profile

Name
Name
Chipmos Technologies Inc ADR
Name
Phone
886 3 577 0055
Name
Address
No. 1, R&D Road 1, Hsinchu Science Park, Hsinchu
Name
Employee
0
Name
Twitter
Name
Next Earnings Date
2024-05-09
Name
Latest SEC Filings
Name
IMOS's Discussions on Twitter

Chipmos Technologies Inc ADR Stock (IMOS) Upgrades & Downgrades

Date Action Analyst Rating Change
Aug-11-16 Reiterated Cowen Outperform
Nov-17-15 Downgrade Morgan Stanley Overweight → Equal-Weight
Oct-08-15 Reiterated Cowen Outperform
Sep-29-15 Reiterated Cowen Outperform
Aug-13-14 Reiterated Cowen Outperform
Aug-15-13 Reiterated Cowen Outperform
Jun-24-13 Reiterated Cowen Hold
Feb-05-13 Initiated Cowen & Co Outperform
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Chipmos Technologies Inc ADR Stock (IMOS) Financials Data

Chipmos Technologies Inc ADR (IMOS) Revenue 2024

IMOS reported a revenue (TTM) of $677.73 million for the quarter ending December 31, 2023.
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Chipmos Technologies Inc ADR (IMOS) Net Income 2024

IMOS net income (TTM) was $62.58 million for the quarter ending December 31, 2023.
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Chipmos Technologies Inc ADR (IMOS) Earnings per Share 2024

IMOS earnings per share (TTM) was $1.705 for the quarter ending December 31, 2023.
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ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors. The company's semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as flat-panel displays. It serves customers in Taiwan, Japan, Korea, Hong Kong, and the United States. The company was founded in 1997 and is headquartered in Hsinchu, Taiwan.
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Cap:     |  Volume (24h):